Paper presented at the 5th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 1-4 July, 2007.
Navier-Stokes and energy equations are numerically solved
for modelling fluid-dynamical and thermal behaviour of air
surrounding horizontally arranged Dual-Inline-Memory-
Modules. A complex three-dimensional flow pattern is
highlighted, that significantly contributes in heat dissipation of
the analysed electronic devices. The present communication
contribute, as scientific and technical tool, for investigation on
critical cooling conditions for electronic equipment and for
innovative projects of fan-less computer architecture.