Three-dimensional multi-physics thermal-analysis system for electronic systems

dc.contributor.authorFukui, M.en
dc.contributor.authorWatanabe, S.en
dc.contributor.authorOmura, T.en
dc.contributor.authorKitagawa, Y.en
dc.contributor.authorTsukiyama, S.en
dc.contributor.authorShirakawa, I.en
dc.date.accessioned2017-08-28T07:08:18Z
dc.date.available2017-08-28T07:08:18Z
dc.date.issued2016en
dc.descriptionPapers presented to the 12th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, Costa de Sol, Spain on 11-13 July 2016.en
dc.description.abstractIn this paper a 3D multi-physical thermal analysis procedure is devised dedicatedly for LSI packages by means of a realistic approximative approach, which is constructed by applying a macro-model to each phenomenon of heat generation, heat transfer, and heat dissipation in a solid material. As a test example, a set of LSI package and surrounding air is formulated with the use of a 3D thermal grid network of size 256x256x10, to which the application of the proposed procedure yields the accuracy and rapidity practically guaranteed by comparison with the numerical analysis and survey experiment.
dc.format.extent6 pagesen
dc.format.mediumPDFen
dc.identifier.urihttp://hdl.handle.net/2263/62008
dc.language.isoenen
dc.publisherHEFATen
dc.rightsUniversity of Pretoriaen
dc.subjectThree-dimensional multi-physicsen
dc.subjectThermal-analysis systemen
dc.subjectElectronic systemen
dc.titleThree-dimensional multi-physics thermal-analysis system for electronic systemsen
dc.typePresentationen

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