Three-dimensional multi-physics thermal-analysis system for electronic systems

Abstract

In this paper a 3D multi-physical thermal analysis procedure is devised dedicatedly for LSI packages by means of a realistic approximative approach, which is constructed by applying a macro-model to each phenomenon of heat generation, heat transfer, and heat dissipation in a solid material. As a test example, a set of LSI package and surrounding air is formulated with the use of a 3D thermal grid network of size 256x256x10, to which the application of the proposed procedure yields the accuracy and rapidity practically guaranteed by comparison with the numerical analysis and survey experiment.