Three-dimensional simulations of electronic memory modules cooling in natural convection conditions

dc.contributor.authorCammarata, G.
dc.contributor.authorPetrone, G.
dc.contributor.authorSorge, G.
dc.date.accessioned2014-07-18T09:02:01Z
dc.date.available2014-07-18T09:02:01Z
dc.date.issued2007
dc.description.abstractPaper presented at the 5th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 1-4 July, 2007.en_US
dc.description.abstractNavier-Stokes and energy equations are numerically solved for modelling fluid-dynamical and thermal behaviour of air surrounding horizontally arranged Dual-Inline-Memory- Modules. A complex three-dimensional flow pattern is highlighted, that significantly contributes in heat dissipation of the analysed electronic devices. The present communication contribute, as scientific and technical tool, for investigation on critical cooling conditions for electronic equipment and for innovative projects of fan-less computer architecture.en_US
dc.description.librariancs2014en_US
dc.format.extent6 pagesen_US
dc.format.mediumPDFen_US
dc.identifier.citationCammarata, G, Petrone, G & Sorge, G 2007, 'Three-dimensional simulations of electronic memory modules cooling in natural convection conditions', Paper presented to the 5th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 1-4 July 2007.en_US
dc.identifier.isbn9781868546435
dc.identifier.urihttp://hdl.handle.net/2263/40887
dc.language.isoenen_US
dc.publisherInternational Conference on Heat Transfer, Fluid Mechanics and Thermodynamicsen_US
dc.relation.ispartofHEFAT 2007
dc.rightsUniversity of Pretoriaen_US
dc.rights.uriUniversity of Pretoriaen_US
dc.subjectHeat dissipation of electronic devicesen_US
dc.subjectCooling for electronic equipmenten_US
dc.subjectFan-less computer architectureen_US
dc.subjectDual-Inline-Memory- Modulesen_US
dc.subjectThree-dimensional flow patternen_US
dc.titleThree-dimensional simulations of electronic memory modules cooling in natural convection conditionsen_US
dc.typePresentationen_US

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