Three-dimensional simulations of electronic memory modules cooling in natural convection conditions
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Date
Authors
Cammarata, G.
Petrone, G.
Sorge, G.
Journal Title
Journal ISSN
Volume Title
Publisher
International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics
Abstract
Paper presented at the 5th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 1-4 July, 2007.
Navier-Stokes and energy equations are numerically solved for modelling fluid-dynamical and thermal behaviour of air surrounding horizontally arranged Dual-Inline-Memory- Modules. A complex three-dimensional flow pattern is highlighted, that significantly contributes in heat dissipation of the analysed electronic devices. The present communication contribute, as scientific and technical tool, for investigation on critical cooling conditions for electronic equipment and for innovative projects of fan-less computer architecture.
Navier-Stokes and energy equations are numerically solved for modelling fluid-dynamical and thermal behaviour of air surrounding horizontally arranged Dual-Inline-Memory- Modules. A complex three-dimensional flow pattern is highlighted, that significantly contributes in heat dissipation of the analysed electronic devices. The present communication contribute, as scientific and technical tool, for investigation on critical cooling conditions for electronic equipment and for innovative projects of fan-less computer architecture.
Description
Keywords
Heat dissipation of electronic devices, Cooling for electronic equipment, Fan-less computer architecture, Dual-Inline-Memory- Modules, Three-dimensional flow pattern
Sustainable Development Goals
Citation
Cammarata, G, Petrone, G & Sorge, G 2007, 'Three-dimensional simulations of electronic memory modules cooling in natural convection conditions', Paper presented to the 5th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 1-4 July 2007.