Three-dimensional simulations of electronic memory modules cooling in natural convection conditions
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| dc.contributor.author | Cammarata, G.
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| dc.contributor.author | Petrone, G.
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| dc.contributor.author | Sorge, G.
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| dc.date.accessioned | 2014-07-18T09:02:01Z | |
| dc.date.available | 2014-07-18T09:02:01Z | |
| dc.date.issued | 2007 | |
| dc.description.abstract | Paper presented at the 5th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 1-4 July, 2007. | en_US |
| dc.description.abstract | Navier-Stokes and energy equations are numerically solved for modelling fluid-dynamical and thermal behaviour of air surrounding horizontally arranged Dual-Inline-Memory- Modules. A complex three-dimensional flow pattern is highlighted, that significantly contributes in heat dissipation of the analysed electronic devices. The present communication contribute, as scientific and technical tool, for investigation on critical cooling conditions for electronic equipment and for innovative projects of fan-less computer architecture. | en_US |
| dc.description.librarian | cs2014 | en_US |
| dc.format.extent | 6 pages | en_US |
| dc.format.medium | en_US | |
| dc.identifier.citation | Cammarata, G, Petrone, G & Sorge, G 2007, 'Three-dimensional simulations of electronic memory modules cooling in natural convection conditions', Paper presented to the 5th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 1-4 July 2007. | en_US |
| dc.identifier.isbn | 9781868546435 | |
| dc.identifier.uri | http://hdl.handle.net/2263/40887 | |
| dc.language.iso | en | en_US |
| dc.publisher | International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics | en_US |
| dc.relation.ispartof | HEFAT 2007 | |
| dc.rights | University of Pretoria | en_US |
| dc.rights.uri | University of Pretoria | en_US |
| dc.subject | Heat dissipation of electronic devices | en_US |
| dc.subject | Cooling for electronic equipment | en_US |
| dc.subject | Fan-less computer architecture | en_US |
| dc.subject | Dual-Inline-Memory- Modules | en_US |
| dc.subject | Three-dimensional flow pattern | en_US |
| dc.title | Three-dimensional simulations of electronic memory modules cooling in natural convection conditions | en_US |
| dc.type | Presentation | en_US |
