Three-dimensional simulations of electronic memory modules cooling in natural convection conditions

Abstract

Paper presented at the 5th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 1-4 July, 2007.

Navier-Stokes and energy equations are numerically solved for modelling fluid-dynamical and thermal behaviour of air surrounding horizontally arranged Dual-Inline-Memory- Modules. A complex three-dimensional flow pattern is highlighted, that significantly contributes in heat dissipation of the analysed electronic devices. The present communication contribute, as scientific and technical tool, for investigation on critical cooling conditions for electronic equipment and for innovative projects of fan-less computer architecture.