Constructal design of combined microchannel and micro pin fins for electronic cooling

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dc.contributor.author Adewumi, O.O. (Olayinka)
dc.contributor.author Bello-Ochende, Tunde
dc.contributor.author Meyer, Josua P.
dc.date.accessioned 2014-04-04T13:13:07Z
dc.date.available 2014-04-04T13:13:07Z
dc.date.issued 2013-11
dc.description.abstract This paper presents a three-dimensional numerical study of steady, laminar, incompressible flow and forced convection heat transfer through a microchannel heat sink with micro pin fin inserts for both fixed and variable axial lengths. The objective of the study was to optimise the geometric configuration of an integrated microchannel and micro pin fins for different solid volumes so that the peak temperature in the configuration was minimised. The effect of the micro pin fins on the optimised microchannel was also investigated. The geometric optimisation of the integrated microchannel and micro pin fin was carried out using a computational fluid dynamics (CFD) code with a goal-driven optimisation tool subject to global constraints. The optimisation procedure was carried out in two steps. Firstly, the microchannel configuration was optimised without the micro pin fins inserted and the results were compared with similar work found in the open literature. This optimisation was carried out for both fixed and relaxed lengths. Thereafter, the integrated design of the microchannel and micro pin fins was optimised. The effect of the Bejan number on the solid volume fraction, channel aspect ratio and hydraulic diameter, pin fin aspect ratio, minimised peak temperature and maximised thermal conductance were reported. Results showed that as the Bejan number increased, the minimised peak temperature decreased. Also, the maximum thermal conductance increased with the optimised microchannel structure with three to six rows of micro pin fin inserts. Diminishing return set in when the number of rows of micro pin fin inserts was greater than three for the fixed length but for the relaxed length, as the number of rows increased, the results improved but when it exceeded six diminishing returns set in for a fixed solid volume of 0.9 mm3. For each Bejan number used in this study, there was an optimum channel hydraulic diameter and aspect ratio, solid volume fraction and pin fin aspect ratio that satisfied the global objective. en
dc.description.librarian hb2014 en
dc.description.librarian ai2014
dc.description.sponsorship NRF, TESP, University of Stellenbosch, University of Pretoria, SANERI/SANEDI, CSIR, EEDSM Hub and NAC en
dc.description.uri http://www.elsevier.com/locate/ijhmt en
dc.identifier.citation Adewumi, OO, Bello-Ochende, T & Meyer, JP 2013, 'Constructal design of combined microchannel and micro pin fins for electronic cooling', International Journal of Heat & Mass Transfer, vol. 66, pp. 315-323. en
dc.identifier.issn 0017-9310 (print)
dc.identifier.issn 1879-2189 (online)
dc.identifier.other /10.1016/j.ijheatmasstransfer.2013.07.039
dc.identifier.uri http://hdl.handle.net/2263/39614
dc.language.iso en en
dc.publisher Elsevier en
dc.rights © 2013 Elsevier Ltd. All rights reserved. Notice : this is the author’s version of a work that was accepted for publication in International Journal of Heat and Mass Transfer. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in International Journal of Heat and Mass Transfer, vol. 66, 2013. doi : 10.1016/j.ijheatmasstransfer.2013.07.039 en
dc.subject Forced convection en
dc.subject Minimised peak temperature en
dc.subject Channel hydraulic diameter en
dc.subject Channel aspect ratio en
dc.subject Solid volume fraction en
dc.subject Pin-fin aspect ratio en
dc.subject Bejan number en
dc.subject Microchannel heat sink en
dc.subject Micro pin fin en
dc.subject.lcsh Computational fluid dynamics en
dc.subject.lcsh Heat sinks (Electronics) en
dc.subject.lcsh Heat -- Transmission en
dc.subject.lcsh Cooling en
dc.title Constructal design of combined microchannel and micro pin fins for electronic cooling en
dc.type Postprint Article en


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