Fukui, M.Watanabe, S.Omura, T.Kitagawa, Y.Tsukiyama, S.Shirakawa, I.2017-08-282017-08-282016http://hdl.handle.net/2263/62008Papers presented to the 12th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, Costa de Sol, Spain on 11-13 July 2016.In this paper a 3D multi-physical thermal analysis procedure is devised dedicatedly for LSI packages by means of a realistic approximative approach, which is constructed by applying a macro-model to each phenomenon of heat generation, heat transfer, and heat dissipation in a solid material. As a test example, a set of LSI package and surrounding air is formulated with the use of a 3D thermal grid network of size 256x256x10, to which the application of the proposed procedure yields the accuracy and rapidity practically guaranteed by comparison with the numerical analysis and survey experiment.6 pagesPDFenUniversity of PretoriaThree-dimensional multi-physicsThermal-analysis systemElectronic systemPresentation