Kim, O.J.Lee, K.H.2014-12-032014-12-032008Kim, OJ & Lee, KH 2008, A study on the hot spot cooling using micro thermoelectric cooler , Paper presented to the 6th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 30 June - 2 July 2008.9781868546916http://hdl.handle.net/2263/42765Paper presented at the 6th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 30 June - 2 July, 2008.An experimental apparatus to show the hot spot cooling of an IC chip using a thermoelectric cooler (TEC) is developed. The spot heating in very small area is achieved by applying CO2 laser source and temperatures are measured using miniature thermocouples. The active effects of thermoelectric cooler on the hot spot cooling system such as rapid heat spreading in the chip and lowering the peak temperature around the hot spot region are investigated. The experimental results are simulated numerically using the TAS program, which the performance characteristics, such as Seebeck coefficient, electrical resistance and thermal conductivity of the thermoelectric cooler are searched by trial and error. Good agreements are obtained between numerical and experimental results if the appropriate performance data of the thermoelectric cooler are given.6 pagesPDFenUniversity of PretoriaHot spot coolingMicro thermoelectric coolerIC chipCO2 laser sourceMiniature thermocouplesRapid heat spreadingLowering the peak temperature around the hot spot regionSeebeck coefficientElectrical resistanceThermal conductivity of the thermoelectric coolerPresentation