Lee, S.T.Kim, C.H.Nahm, S.Lee, S.H.Lee, S.G.Kim, H,T.2016-07-192016-07-192015Lee, ST, Kim, CH, Nahm, S, Lee, SH, Lee, SG & Kim, HT 2015, 'Fabrication of high thermal conductivity ceramic hybrid materials for power elctronics and integrated packages', Paper presented to the 11th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, Florida, 20-23 July 2015.97817759206873http://hdl.handle.net/2263/55920Papers presented to the 11th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 20-23 July 2015.High thermal conductivity with electrically insulating substrates and thermal interface materials are in a great demand for high density and high power electronic packaging applications. The choice of ceramic-polymer hybrid films provide many advantage in electrical and thermal behaviour due its intrinsic nature of high thermal conductivity and high breakdown voltage, environmental and thermal stability. This work present the preparation hybrid films with mechanically exfoliated h-BN ceramic sheets and PVA polymer, and the effect of exfoliation, solid loading, particle sizes, compression pressures on the composite films were investigated. And the results are compared with the theoretical models like Arithmetic and Wiener equations that frequently used in the two phase mixture composites.PDFen© 2015 University of Pretoria. All rights reserved. The copyright in this work vests in the University of Pretoria. No part of this work may be reproduced or transmitted in any form or by any means, without the prior written permission of the University of Pretoria.Hybrid filmsArithmetic and Wiener equationsHigh thermal conductivityElectrical and thermal behaviourPresentation