Heat pipe with nano enhanced-PCM for electronic cooling application

dc.contributor.authorKrishna, Jogi
dc.contributor.authorKishore, P.S.
dc.contributor.authorSolomon, A. Brusly
dc.date.accessioned2016-11-14T08:29:55Z
dc.date.issued2017-02
dc.description.abstractIn this study, the thermal performance of a heat pipe using nano enhanced Phase Change Material (PCM) as an energy storage medium for electronic cooling application is studied. The PCM is placed around the adiabatic section of the heat pipe in which heat is absorbed and released depending on the power inputs at the evaporator and fan speeds at the condenser. Experiments are performed to obtain the evaporator, condenser and PCM temperature distributions during the charge, discharge and simultaneous charge/discharge processes. In the present study, Water, Tricosane and nano enhanced Tricosane are used as energy storage materials. The nano enhanced PCMs are prepared by mixing different volume percentage (0.5%, 1% and 2%) of Al2O3 nanoparticles with Tricosane. Thermal conductivity of nano enhanced PCM is measured and found to be enhanced to a maximum of 32% compared to pure Tricosane. The effects of PCM filling volumes, fan speeds and heating power on the performance of cooling module are also investigated. From this study it is found that the evaporator temperature of heat pipe with nano enhanced PCM is decreased about 25.75%, which can save 53% of the fan power compared with the traditional heat pipe. Also found that the nano enhanced PCM can store almost 30% of the energy supplied at the evaporator leading to the reduction in fan power consumption.en_ZA
dc.description.departmentMechanical and Aeronautical Engineeringen_ZA
dc.description.embargo2018-02-28
dc.description.librarianhb2016en_ZA
dc.description.librarianmi2025en
dc.description.sdgSDG-09: Industry, innovation and infrastructureen
dc.description.sdgSDG-07: Affordable and clean energyen
dc.description.sdgSDG-12: Responsible consumption and productionen
dc.description.urihttp://www.elsevier.com/locate/etfsen_ZA
dc.identifier.citationKrishna, J, Kishore, PS & Solomon, AB 2017, 'Heat pipe with nano enhanced-PCM for electronic cooling application', Experimental Thermal and Fluid Science, vol. 81, pp. 84-92.en_ZA
dc.identifier.issn0894-1777
dc.identifier.other10.1016/j.expthermflusci.2016.10.014
dc.identifier.urihttp://hdl.handle.net/2263/58030
dc.language.isoenen_ZA
dc.publisherElsevieren_ZA
dc.rights© 2016 Elsevier Inc. All rights reserved. Notice : this is the author’s version of a work that was accepted for publication in Experimental Thermal and Fluid Science. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. A definitive version was subsequently published in Experimental Thermal and Fluid Science, vol. 81, pp. 84-92, 2017. doi : 10.1016/j.expthermflusci.2016.10.014.en_ZA
dc.subjectHeat pipeen_ZA
dc.subjectElectronic coolingen_ZA
dc.subjectNanoparticlesen_ZA
dc.subjectThermal storageen_ZA
dc.subjectThermal managementen_ZA
dc.subjectPhase change material (PCM)en_ZA
dc.subject.otherEngineering, built environment and information technology articles SDG-09
dc.subject.otherSDG-09: Industry, innovation and infrastructure
dc.subject.otherEngineering, built environment and information technology articles SDG-07
dc.subject.otherSDG-07: Affordable and clean energy
dc.subject.otherEngineering, built environment and information technology articles SDG-12
dc.subject.otherSDG-12: Responsible consumption and production
dc.titleHeat pipe with nano enhanced-PCM for electronic cooling applicationen_ZA
dc.typePostprint Articleen_ZA

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