Experimental study of a hybrid CNT/PCM structure for the transient thermal management of electronics
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Date
Authors
Kinkelin, C.
Lips, S.
Lefevre, F.
Soupremanien, U.
Remondiere, V.
Dijon, J.
Le Poche, H.
Ollier, E.
Zegaoui, M.
Rolland, N.
Journal Title
Journal ISSN
Volume Title
Publisher
International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics
Abstract
Papers presented to the 11th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 20-23 July 2015.
A Thermal Interface Material with Thermal Storage capacity (TIM-TS) consisting mainly of a carbon nanotubes (CNT) array filled with phase change material (PCM) and integrated between two silicon chips is experimentally studied by means of a heating laser and an infrared camera in order to characterize its thermal behavior. The TIM-TS is intended to smooth temperature peaks of transient electronic components as a result of the high latent heat of the embedded PCM while keeping a high global thermal conductance thanks to the CNT array linking its two silicon chips. These two thermal properties are estimated thanks to the measured thermal response of different TIM-TS prototypes. A decrease of 5 K of the maximum TIM-TS temperature is measured with a mass fraction of PCM as low as 2.4%. The qualitative estimation of the thermal contact resistances at the CNT/silicon interfaces enables to identify the location of the major thermal resistance for the tested samples.
A Thermal Interface Material with Thermal Storage capacity (TIM-TS) consisting mainly of a carbon nanotubes (CNT) array filled with phase change material (PCM) and integrated between two silicon chips is experimentally studied by means of a heating laser and an infrared camera in order to characterize its thermal behavior. The TIM-TS is intended to smooth temperature peaks of transient electronic components as a result of the high latent heat of the embedded PCM while keeping a high global thermal conductance thanks to the CNT array linking its two silicon chips. These two thermal properties are estimated thanks to the measured thermal response of different TIM-TS prototypes. A decrease of 5 K of the maximum TIM-TS temperature is measured with a mass fraction of PCM as low as 2.4%. The qualitative estimation of the thermal contact resistances at the CNT/silicon interfaces enables to identify the location of the major thermal resistance for the tested samples.
Description
This project was carried out in collaboration with the CEALiten,
the IEMN, Kaplan Energy and STMicroelectronics. It
was supported by the ANR P2N “THERMA3D” project
N°ANR-11-NANO-011.
Keywords
(TIM-TS), Phase change material, Heating laser, Temperature
Sustainable Development Goals
Citation
Kinkelin, C, Lips, S, Lefevre, F, Soupremanien, U, Remondiere, V, Dijon, J, Le Poche, H, Ollier, E,Zegaoui, M, Rolland, N, Rolland, P-A, Lhostis, S, Descouts, B & Kaplan, Y 2015, 'Experimental study of a hybrid CNT/PCM structure for the transient thermal management of electronics', Paper presented to the 11th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, Florida, 20-23 July 2015.