Low-resourced communities benefit from 3D-printed electronic systems

dc.contributor.authorSmith, Suzanne
dc.contributor.authorJoubert, Trudi-Heleen
dc.date.accessioned2021-06-14T14:23:34Z
dc.date.available2021-06-14T14:23:34Z
dc.date.issued2020
dc.description.abstractImagine that a smart and interconnected sensor system can be formed digitally in an economical and environmentally friendly way. Now imagine that it can be done in South Africa, near low-resourced communities who need these products the most. One need not only imagine – the local design and manufacture of smart sensors and wireless sensor networks are precisely the overarching vision of the Integrated Microelectronic Sensor System Research Programme of the Carl and Emily Fuchs Institute for Microelectronics (CEFIM) in the Department of Electrical, Electronic and Computer Engineering.en_ZA
dc.description.departmentElectrical, Electronic and Computer Engineeringen_ZA
dc.description.librarianhj2021en_ZA
dc.description.urihttps://issuu.com/universityofpretoria/docs/innovate_15_2020en_ZA
dc.identifier.citationSmith, S. & Joubert, T. 2020, 'Low-resourced communities benefit from 3D-printed electronic systems', Innovate, no 15, pp. 67-69.en_ZA
dc.identifier.urihttp://hdl.handle.net/2263/80311
dc.language.isoenen_ZA
dc.publisherUniversity of Pretoria, Graduate School of Technology Managementen_ZA
dc.rightsThe University of Pretoria’s Faculty of Engineering, Built Environment and Information Technology.en_ZA
dc.subjectLow-resourced communitiesen_ZA
dc.subjectSmart sensorsen_ZA
dc.subjectWireless sensor network (WSN)en_ZA
dc.subject3D-printed electronic systemsen_ZA
dc.titleLow-resourced communities benefit from 3D-printed electronic systemsen_ZA
dc.typeArticleen_ZA

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
Smith_Low_2020.pdf
Size:
1.1 MB
Format:
Adobe Portable Document Format
Description:
Article

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.75 KB
Format:
Item-specific license agreed upon to submission
Description: