A study on the hot spot cooling using micro thermoelectric cooler

dc.contributor.authorKim, O.J.
dc.contributor.authorLee, K.H.
dc.date.accessioned2014-12-03T08:39:17Z
dc.date.available2014-12-03T08:39:17Z
dc.date.issued2008
dc.description.abstractPaper presented at the 6th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 30 June - 2 July, 2008.en_US
dc.description.abstractAn experimental apparatus to show the hot spot cooling of an IC chip using a thermoelectric cooler (TEC) is developed. The spot heating in very small area is achieved by applying CO2 laser source and temperatures are measured using miniature thermocouples. The active effects of thermoelectric cooler on the hot spot cooling system such as rapid heat spreading in the chip and lowering the peak temperature around the hot spot region are investigated. The experimental results are simulated numerically using the TAS program, which the performance characteristics, such as Seebeck coefficient, electrical resistance and thermal conductivity of the thermoelectric cooler are searched by trial and error. Good agreements are obtained between numerical and experimental results if the appropriate performance data of the thermoelectric cooler are given.en_US
dc.description.librarianvk2014en_US
dc.format.extent6 pagesen_US
dc.format.mediumPDFen_US
dc.identifier.citationKim, OJ & Lee, KH 2008, A study on the hot spot cooling using micro thermoelectric cooler , Paper presented to the 6th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 30 June - 2 July 2008.en_US
dc.identifier.isbn9781868546916
dc.identifier.urihttp://hdl.handle.net/2263/42765
dc.language.isoenen_US
dc.publisherInternational Conference on Heat Transfer, Fluid Mechanics and Thermodynamicsen_US
dc.relation.ispartofHEFAT 2008en_US
dc.rightsUniversity of Pretoriaen_US
dc.subjectHot spot coolingen_US
dc.subjectMicro thermoelectric cooleren_US
dc.subjectIC chipen_US
dc.subjectCO2 laser sourceen_US
dc.subjectMiniature thermocouplesen_US
dc.subjectRapid heat spreadingen_US
dc.subjectLowering the peak temperature around the hot spot regionen_US
dc.subjectSeebeck coefficienten_US
dc.subjectElectrical resistanceen_US
dc.subjectThermal conductivity of the thermoelectric cooleren_US
dc.titleA study on the hot spot cooling using micro thermoelectric cooleren_US
dc.typePresentationen_US

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