Electroluminescence from two junction punch through structures in silicon nanowires

dc.contributor.authorDu Plessis, Monuko
dc.contributor.authorJoubert, Trudi-Heleen
dc.contributor.emailmonuko@up.ac.zaen_ZA
dc.date.accessioned2016-06-21T05:48:26Z
dc.date.available2016-06-21T05:48:26Z
dc.date.issued2015-08
dc.description.abstractHot carrier electroluminescence in two junction devices under punch through conditions manufactured in silicon on insulator nanowires are investigated. Of interest is the spectral content of the light emission, as well as the external power efficiency and the light extraction efficiency. An order of magnitude improvement in external power efficiency was achieved relative to a bulk silicon p-n junction in avalanche.en_ZA
dc.description.departmentElectrical, Electronic and Computer Engineeringen_ZA
dc.description.librarianhb2016en_ZA
dc.description.urihttp://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=68en_ZA
dc.identifier.citationDu Plessis, M & Joubert, T-H 2015, 'Electroluminescence from two junction punch through structures in silicon nanowires', IEEE Photonics Technology Letters, vol. 27, no. 16, pp. 1741-1744.en_ZA
dc.identifier.issn1041-1135
dc.identifier.other10.1109/LPT.2015.2438956
dc.identifier.urihttp://hdl.handle.net/2263/53269
dc.language.isoenen_ZA
dc.publisherInstitute of Electrical and Electronics Engineersen_ZA
dc.rights© 2015 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.en_ZA
dc.subjectSilicon electroluminescenceen_ZA
dc.subjectNanowireen_ZA
dc.subjectHot carriersen_ZA
dc.subjectSilicon on insulator (SOI)en_ZA
dc.titleElectroluminescence from two junction punch through structures in silicon nanowiresen_ZA
dc.typePostprint Articleen_ZA

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
DuPlessis_Electroluminescence_2015.pdf
Size:
3.08 MB
Format:
Adobe Portable Document Format
Description:
Postprint Article

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.75 KB
Format:
Item-specific license agreed upon to submission
Description: