Abstract:
The aim of this document is to provide the reader with information regarding the quality problems the company Parsec (Pty) Ltd experiences in their manufacturing facility, and the solution to solving this problem. Research has been done in order to understand what companies in the same industry with similar problems have done to address the problem.
The document first provides the background of the company and its related industry. The problem investigation follows, with detailed information regarding the production process of producing electronic printed circuit boards. After this, a thorough literature study is presented, with technical aspects of printed circuit boards, as well as an investigation into the case studies regarding companies with similar problems. Relevant data was then captured and analysed, after which a demonstration of the solution to reducing defects on printed circuit boards, follows.
With the limited data captured and analysed in this project, it can be concluded that Parsec has to focus energy in investigating the reason for the significant amount of missing components, damaged components, and dry joints on their PCBs. Further, the solution will aid production managers in monitoring future defects on the PCBs. Once a defect to be reduced has been identified, it would be recommended for Parsec’s technicians to use SPC as well to monitor and control the characteristics of that specific defect.
