A heat exchanger dedicated to the cooling of a microprocessor
has been designed and realized. This heat exchanger consists
of a bottom wall in contact with the processor and a cover that
has been dug to a depth of 200μm on one side and 1 mm on the
other side. Thus, by turning the cover, the hydraulic diameter of
the channel can be changed. This heat exchanger has been experimentally
tested both from hydraulic and thermal performances
point of view. At the same time, 3D numerical simulations were
carried out using commercial software based on finite volume
method (StarCCM+) on a virtual model of the experimental prototype.
Comparisons between numerical and experimental results
are in good agreement. In particular, the influence of the
distributor and the collector on the distribution of fluid flow and
heat fluxes is emphasized.
Papers presented at the 13th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, Portoroz, Slovenia on 17-19 July 2017 .