Three-dimensional multi-physics thermal-analysis system for electronic systems

Fukui, M.; Watanabe, S.; Omura, T.; Kitagawa, Y.; Tsukiyama, S.; Shirakawa, I.

dc.contributor.author	Fukui, M.	en
dc.contributor.author	Watanabe, S.	en
dc.contributor.author	Omura, T.	en
dc.contributor.author	Kitagawa, Y.	en
dc.contributor.author	Tsukiyama, S.	en
dc.contributor.author	Shirakawa, I.	en
dc.date.accessioned	2017-08-28T07:08:18Z
dc.date.available	2017-08-28T07:08:18Z
dc.date.issued	2016	en
dc.description	Papers presented to the 12th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, Costa de Sol, Spain on 11-13 July 2016.	en
dc.description.abstract	In this paper a 3D multi-physical thermal analysis procedure is devised dedicatedly for LSI packages by means of a realistic approximative approach, which is constructed by applying a macro-model to each phenomenon of heat generation, heat transfer, and heat dissipation in a solid material. As a test example, a set of LSI package and surrounding air is formulated with the use of a 3D thermal grid network of size 256x256x10, to which the application of the proposed procedure yields the accuracy and rapidity practically guaranteed by comparison with the numerical analysis and survey experiment.
dc.format.extent	6 pages	en
dc.format.medium	PDF	en
dc.identifier.uri	http://hdl.handle.net/2263/62008
dc.language.iso	en	en
dc.publisher	HEFAT	en
dc.rights	University of Pretoria	en
dc.subject	Three-dimensional multi-physics	en
dc.subject	Thermal-analysis system	en
dc.subject	Electronic system	en
dc.title	Three-dimensional multi-physics thermal-analysis system for electronic systems	en
dc.type	Presentation	en