With an ever increasing number of broadband
applications in sub-Saharan Africa, mm-wave point-to-point
networking has the potential to fill a niche in communications
network architectures. Widespread adoption of this technology
would benefit from conventional RF soft substrate integration
and packaging, as opposed to system-on-chip or thick film
processes. A review on the state-of-the-art in E-band soft
substrate systems reveals significant reliance on MMICs. We
propose that hybrid integration of active devices with off-chip
passives, as well as better integration of active components in
SIW, will lead to better performing E-band systems in soft
substrates. Specific enabling techniques from the microwave
domain are identified.
Paper presented at the IEEE Africon 2015 : IEEE Africon Green Innovation for African Renaissance, 14-17 September 2015, Addis Ababa, Ethiopia.