Fukui, M.; Watanabe, S.; Omura, T.; Kitagawa, Y.; Tsukiyama, S.; Shirakawa, I.
(HEFAT, 2016)
In this paper a 3D multi-physical thermal analysis procedure
is devised dedicatedly for LSI packages by means of a realistic
approximative approach, which is constructed by applying a
macro-model to each phenomenon of ...