Abstract:
In recent times, high power density trends and temperature constraints in integrated circuits have led to conventional cooling techniques not being sufficient to meet the thermal requirements. The ever-increasing desire to overcome this problem has led to worldwide interest in micro heat sink design of electronic components. It has been found that geometric configurations of micro heat sinks play a vital role in heat transfer performance. Therefore, an effective means of optimally designing these heat sinks is required. Experimentation has extensively been used in the past to understand the behaviour of these heat extraction devices. Computational fluid dynamics (CFD) has more recently provided a more cost-effective and less time-consuming means of achieving the same objective. However, in order to achieve optimal designs of micro heat sinks using CFD, the designer has to be well experienced and carry out a number of trial-and-error simulations. Unfortunately, this will still not always guarantee an accurate optimal design. In this dissertation, a design methodology which combines CFD with a mathematical optimisation algorithm (a leapfrog optimisation program and DYNAMIC-Q algorithm) is proposed. This automated process is applied to three design cases. In the first design case, the peak wall temperature of a microchannel embedded in a highly conductive solid is minimised. The second case involves the optimisation of a double row micropin-fin heat sink. In this case, the objective is to maximise the total rate of heat transfer with the effect of the thermal conductivity also being investigated. The third case extends the micropin-fin optimisation to a heat sink with three rows. In all three cases, fixed volume constraint and manufacturing restraints are enforced to ensure industrial applicability. Lastly, the trends of the three cases are compared. It is concluded that optimal design can be achieved with a combination of CFD and mathematical optimisation.
