Papers presented to the 11th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 20-23 July 2015.
A Thermal Interface Material with Thermal Storage
capacity (TIM-TS) consisting mainly of a carbon nanotubes
(CNT) array filled with phase change material (PCM) and
integrated between two silicon chips is experimentally studied
by means of a heating laser and an infrared camera in order to
characterize its thermal behavior. The TIM-TS is intended to
smooth temperature peaks of transient electronic components as
a result of the high latent heat of the embedded PCM while
keeping a high global thermal conductance thanks to the CNT
array linking its two silicon chips. These two thermal properties
are estimated thanks to the measured thermal response of
different TIM-TS prototypes. A decrease of 5 K of the
maximum TIM-TS temperature is measured with a mass
fraction of PCM as low as 2.4%. The qualitative estimation of
the thermal contact resistances at the CNT/silicon interfaces
enables to identify the location of the major thermal resistance
for the tested samples.
