Abstract:
Rutherford backscattering spectrometry(RBS) analysis , carried out at various annealing temperatures, of a thin
film of ruthenium on n-type 4-hexagonal silicon carbide (4H-SiC) showed evidence of ruthenium oxidation,
ruthenium silicide formation and diffusion of ruthenium into silicon carbide starting from an annealing
temperature of 400oC. Ruthenium oxidation was more pronounced, and ruthenium and Silicon inter-diffusion
was very deep after annealing at 800oC. Raman analysis of some samples also showed ruthenium silicide
formation and oxidation. The Schottky barrier diodes showed very good linear capacitance-voltage
characteristics and excellent forward current-voltage characteristics, despite the occurrence of the chemical
reactions and inter-diffusion of ruthenium and silicon at ruthenium-silicon-carbide interface, up to an annealing
temperature of 800oC.
