Paper presented at the 6th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, South Africa, 30 June - 2 July, 2008.
An experimental apparatus to show the hot spot cooling of
an IC chip using a thermoelectric cooler (TEC) is
developed. The spot heating in very small area is achieved by
applying CO2 laser source and temperatures are measured using
miniature thermocouples. The active effects of thermoelectric
cooler on the hot spot cooling system such as rapid heat
spreading in the chip and lowering the peak temperature around
the hot spot region are investigated. The experimental results
are simulated numerically using the TAS program, which the
performance characteristics, such as Seebeck coefficient,
electrical resistance and thermal conductivity of the
thermoelectric cooler are searched by trial and error. Good
agreements are obtained between numerical and experimental
results if the appropriate performance data of the thermoelectric
cooler are given.
